집적회로 형성 공정 및 특성평가에 대한 이론을 이해한다. pn접합, Bipolar 트랜지스터, MOSFET 등의 제조방법인 단위공정인 증착, 산화, 확산, 이온주입, 진공, 금속접합, 식각공정 등과 관련이론을 학습한다.
교과목해설(영문)
Integration technology will be covered in terms of device fabrication process and electrical and electronic characterization of the fabricated devices. Student will learn how unit device is operated and what kind of fabrication procedure has to be used. Unit process such as Lithography and Etching, Oxidation, Diffusion, Ion Implantation, Thin Film Deposition, PVD, CVD, Epitaxy, Interconnection, MOS Process Integration, MOS Capacitor, BJT Integration will be treated in this course.
